Events

Description:

Polymers in Electronic Packaging

November 4 and 5, 2019

A Two-Day Short Course

A Joint event of the Golden Gate Polymer Forum
and the Santa Clara Valley chapter of ASM International

Overview

The short course will be delivered by Dr. Jeff Gotro and Dr. Bruce Prime, experts in the field of thermosetting polymers and processes. It will provide an overview of polymers and the important structure-property-process-performance relationships for thermosets with emphasis on electronic packaging. In the context of this short course, electronic packaging comprises the materials and structures used to connect the finished semiconductor chip with other electronic components (such as memory chips, camera modules, displays, etc.). Some examples are die attach adhesives, underfills, polymer dielectric redistribution layers, encapsulants, semiconductor substrates, and high density printed circuit boards. The focus will be on the types of thermosetting polymers and processes used in electronic packaging. Course sponsors will have the opportunity to display their product lines and exhibit the latest tools for thermoset characterization.

This course is geared toward technical professionals with backgrounds in chemistry, engineering, or materials science.

The combination of excellent presenters, a convenient location in the Bay Area, an affordable price, and a focus on practical applications provides an exceptional opportunity to increase your knowledge in the area of electronic packaging.

Topics Covered

Monday November 4: Polymers in Packaging (8:15AM to 5:30PM)
• Registration Opens, Continental Breakfast 7:30 am
• Introduction to Electronic Packaging
• Thermosets - Gelation, Vitrification, Curing and Cure Kinetics
• Wirebond Packaging - Leadframe and Plastic Ball Grid Array
• Flip Chip Packaging - Capillary and Wafer Level Underfills
• Fan-out Wafer Level Packaging - Mold Compounds and Redistribution Layers (RDL)
• Advanced Substrates - High-Density Interconnect, Build-up Films for High Density Substrates
• Package Reliability Testing
• Wine & cheese reception 4:00 pm to 5:30 pm

Tuesday November 5: Thermoset Characterization (8:30AM to 5:00PM)
• Continental Breakfast 8:00 am
• Differential Scanning Calorimetry (DSC)
• Thermomechanical Analysis (TMA)
• Thermogravimetric Analysis (TGA)
• Dynamic Mechanical Analysis (DMA) measurements, Oscillatory Rheology
• Rheological Measurements of Uncured Thermoset Adhesives (dispensing, shear thinning, yield point)
• Rheological Measurements During Thermoset Curing
• Thermoset Processing Case Studies
• Question & Answer Session

Instructor Background

Jeff Gotro, Ph.D. is the Founder and President of InnoCentrix* and is a nationally- recognized authority in thermosetting polymers. He has over 35 years’ experience in polymers used in electronics, having held scientific and leadership positions at IBM, AlliedSignal, Honeywell International, and Ablestik Laboratories. During his career, Jeff has commercialized over $100 million in new products used in electronic packaging applications. He has published 60 technical papers in the field of polymeric materials for advanced electronic packaging applications (including 4 book chapters, one with Dr. Prime on “Thermosets” in the Encyclopedia of Polymer Science and Technology, 2017) and holds 15 issued US patents and has 4 patents pending. Dr. Gotro is a Fellow of the International Microelectronics Assembly and Packaging Society (IMAPS) and in 2014 received the John A. Wagnon Technical Achievement award for his numerous technical contributions in the field of polymers in electronic packaging.

Bruce Prime, Ph.D. is a Principal Consultant at InnoCentrix* and is a recognized authority on the cure and properties of crosslinked polymer systems. In his 30-year IBM career, he led teams responsible for developing and implementing polymer applications for printer and information storage technologies. He holds 8 patents and is the author of more than 65 technical papers. He wrote the chapter on “Thermosets” in Thermal Characterization of Polymeric Materials (E. A. Turi ed, Academic Press 1981, 1997), and co-edited Thermal Analysis of Polymers: Fundamentals and Applications (Wiley, 2009). Dr. Prime is a fellow of SPE and NATAS and was the 1989 recipient of the international Mettler-Toledo Award in Thermal Analysis.
*Polymer and innovation experts at InnoCentrix provide a wide range of consulting services to growth-oriented companies that use polymers to gain a competitive advantage.

Practical Details

The location of the course will be:

Michaels at Shoreline
2960 N Shoreline Blvd
Mountain View, CA 94043
(650) 962-1014 (do NOT contact Michael's for course information)
Directions
Map

• Additional instructions will be provided by October 28 to those who register for the event.
• Lunch will be provided on site each day.
• Hardcopy lecture notes from each day will be provided to all attendees.

Payment Information

Early Registration (on or before October 4) - $595
Late Registration (October 5-18) - $695

• No registration possible after October 18
• Advance Registration and payment required. No drop-ins will be allowed.
• No reservation will be considered complete until payment is received.

Accommodation

For attendees who require hotel reservations, numerous hotels are nearby in Mountain View and Palo Alto that are close to Michael's at Shoreline. (Search Google Maps for Hotels near Mountain View) The closest airports in order of distance (closest to farthest) are San Jose, San Francisco, and Oakland.

Registration Details

(1) Begin the registration process by going to the main web page, www.GGPF.org, clicking on "Polymers in Electronic Packaging (Short Course)". On the page that appears next, you will see all the course information. To register, scroll down to the bottom of the page.

• There is only one option available for registration. Simply fill in all your personal details, including name, affiliation, email address, etc. The early registration discount will automatically apply if appropriate.
• After you have completed all the required information, click "Submit" at the bottom of the page. This will take you to a page where you can review your information.
• Click "Confirm Registration" at this time. This will take you to a page where you can choose to pay via Credit Card (via PayPal) or Check.  We are requesting that all short course registrants choose the Credit Card (via PayPal) option.
• Click on the "PayPal" icon. This will redirect you to the PayPal website where you can submit your credit card information and complete the payment process.
• A PayPal account is not necessary.  If you do not have a PayPal account, or if you do not wish to use one which you may already have, do not use the "login" option at the PayPal website; select "Pay with Debit or Credit Card" instead.
• If you have any technical difficulties in making payment, or for any reason you cannot use credit card payment, contact David Olmeijer for further instructions at dolmeijer@gmail.com
• If a registration appears incomplete, we will contact you for further clarification.
• If your company requires it, the GGPF Tax ID# will be provided to you by e-mailing a request to David Olmeijer at dolmeijer@gmail.com. Please note that the conference registration fee covers the short course expenses and is not a tax deductible donation.

(2) Your registration will not be complete until payment is received.

(3) An automated e-mail receipt will be provided as soon as you register and is usually sufficient for corporate reimbursement. You will also be given a receipt when you arrive for the class on the first day.

(4) Reservations will be accepted in the order received until the class size limit is reached. Early reservations are encouraged. No reservations after are possible after October 18.

(5) If someone other than the intended attendee is performing the registration process, please ensure that it is the intended attendee whose name appears in the appropriate field in the registration.

Cancellation Policy

Cancellations by you: allowed until October 18 - you will receive a refund minus a fixed $50 administrative cancellation fee. You must cancel in writing or e-mail and have a verifiable acknowledgment from us that you have cancelled in time. No cancellations allowed after April 22. Registrants who fail to attend and who did not cancel in time will not receive a refund. If you personally cannot attend, another attendee from your organization may substitute (by arrangement only; contact Jennifer Hoffman (jmchoff@gmail.com) or Jason James (jasjam1301@gmail.com).

Cancellations by GGPF/ASM: in the unlikely event that not enough registrations are obtained, the class will be cancelled. If this happens, you will be notified by October 18 and you will receive a full refund.

Thinking about Sponsoring this Event?

The advantages of sponsorship include:
• Introduction of your services/products to influential scientists and engineers responsible for developing next generation products
• Gaining access to decision makers
• Networking with high technology professionals
• Increasing your company visibility
• Making new contacts
• Two sponsorship package options to choose from

LEVEL 1 Logo Sponsor: $200
• Company name on event advertising
• One full page printed company advertisement in the conference proceedings
• Verbal introduction and noted appreciation announced by conference organizer/chair

LEVEL 2 Tabletop Sponsor: $695
• All Level 1 benefits, plus
• A reserved tabletop with sponsor’s advertising materials and/or instruments displayed during event
• Inclusion in all breaks and networking activities
• Access to lectures and meals
• Copy of proceedings
• A list of attendees and their affiliations, by request
• A second person may attend for $100. This includes inclusion in breaks, networking and meals, but not the lectures or proceedings.

Contact Information

For course content details, contact Bruce Prime (rbruceprime@gmail.com)
To sponsor, contact Jason James (jasjam1301@gmail.com)
For registration difficulties, contact webmaster@ggpf.org.
If you can’t reach the webmaster, contact Jennifer Hoffman (jmchoff@gmail.com).

About

The Golden Gate Polymer Forum (GGPF) is a successful 39-year non-profit educational organization dedicated to the study of polymeric materials and devices. We sponsor well attended monthly polymer forums, annual symposiums and short-courses. The GGPF attracts scientists, engineers, and sales professionals (from start-ups to Fortune 100 companies), as well as academics, all of whom are interested in the study of and advancements in polymer science, materials, or engineering. GGPF events, in addition to providing a forum for cutting edge research and industry practices, allows for collaborative networking. The majority of our attendees are from the Bay Area, yet we attract people from out of state as well as international guests, thanks to our reputation in the industry as a premier and easily affordable educational forum.

ASM International is the world's largest source of materials information for engineers and scientists. Since 1957, the Santa Clara Valley Chapter of ASM International has been dedicated to informing, educating, and connecting the materials community in the Bay Area, including those working in the semiconductor, electronics, biomedical, aerospace, and automotive industries. Monthly technical meetings (including networking discussions about attendees' current challenges) and announcements of other regional educational opportunities are publicized. Additionally, our organization has dedicated resources to supporting local universities through scholarships and student mentorship