Thermally Integrated EMI Shielding Materials, Systems and Approaches for Optimal Performance by Mark Hansen and Merima Trako, Vanguard Products Corporation



Thermally Integrated EMI Shielding Materials, Systems and Approaches for Optimal Performance

Mark Hansen and Merima Trako

Vanguard Products Corporation

Wednesday, October 14,   Webinar 6:30 PM Pacific time

Part two of two consecutive monthly presentations on the implications of 5G for polymeric materials needs.


The implementation of millimeter wave systems that can operate at frequencies greater than 25 GHz within 5G and 6G systems has caused internal thermal and signal management to become more important. External packaging, antenna systems design, EMI shielding, heat dissipation, and board layout becomes more difficult as the system sizes shrink and battery consumption is placed at a premium. Various European and US regulations limit the temperatures on user contact surfaces of mobile electronics because of user safety concerns. Many of the new 5G/6G mm wave systems can generate internal operating temperatures approaching and exceeding 100°C when operating at full capacity. As a result, manufacturers often throttle these chipsets periodically to minimize temperature rise of the chipsets. Further, the presence of sensitive antennas within the systems along with potential cross talk issues drives the need for extensive interference protection within the systems, especially in systems incorporating advanced wifi. Engineers and designers are presented with the challenge of optimizing systems to increase heat transfer from the system without negatively interfering with antenna systems and EMI shielding performance, all the while ensuring that high volume producibility of the systems is not negatively impacted.

This discussion will complement the previous Sept. 30 webinar (link) in that it will focus on the macro systems and materials within these electronics from the chipset surface/board out to the user interface. It will review the thermoplastic and thermoset polymeric materials designed for heat transfer and thermal dissipation and discuss mechanical attributes of each. The discussion will also highlight new approaches and materials to improve the thermal and de-sense performance of the 5G/6G electronic systems and assemblies. As 5G and 6G systems are being included in “non-traditional” applications such as in the medical and automotive fields, these topics are of interest to engineers and designers who may not have been presented with these issues in the past, as well as experienced engineers and designers within the communications field.

Speaker Background:

Mark Hansen is the Sales and Marketing Manager for Vanguard Products Corporation, a manufacturer of elastomeric based shielding and thermal composite materials located in Danbury, CT. He has a BS in Mechanical Engineering from Worcester Polytechnic Institute. Prior to joining Vanguard Products, he served as a Field Applications Engineer for W. S. Shamban and Co. Polymer Technologies Group out of Newbury Park, CA, a company specializing in high-end thermoplastic PEEK, PTFE, and PEK materials, and as Field Sales Engineer for General Electric Power Delivery and Controls. He has been with Vanguard for the past 28 years serving in applications and sales development roles for EMI shielding products and later for overall product lines including elastomeric extrusion and molded products. He also sits on the Board Of Directors for Vanguard (Japan) Co. Ltd. based in Kobe, Japan.

Merima Trako is the EMI Shielding Product Manager at Vanguard Products Corporation. She has a BS in Electrical Engineering and Mathematics from the University of Evansville, and an MBA with a concentration in Management and International Business from the University of Connecticut. She holds various advanced certificates in mechanical modeling and design with a focus on the thermal properties of fluids and advanced assembly techniques. Before joining Vanguard, she worked for Diba Industries, a manufacturer of fluid solutions for the medical industry, where she focused on fluid mechanics, polymer material properties, as applied to fluid delivery and fluid heating systems. At Diba, she managed a team of Applications Engineers focused on developing new solutions for customers. Over 17 years, Merima has been involved in solving many complex material solutions for a global customer base.

EVENT DATE: Wednesday, October 14

Registration deadline: Monday, October 12, 1:00 PM.

Registration may close earlier than the nominal deadline if capacity is reached.

This event will be FREE OF CHARGE, but we still require you to fill out the registration form. In particular, we need to have your name and email address for you to be able to participate.

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Webinar Timing: Start Time 6:30 PM. 

(Zoom meeting room will open earlier)

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