Rheology and Processing of Thermosetting Polymers By Dr. Jeffrey Gotro


Monthly Dinner Meeting
Tuesday, Jan. 23, 2001

"Rheology and Processing of Thermosetting Polymers"
Dr. Jeffrey Gotro


During the fabrication of a typical multilayer substrates
for printed circuit boards or high density chip carriers,
the lamination processes subject partially cured thermo-
setting resins to a rising temperature profile to the
final curing temperature. The rheological flow window is
defined by the rapid decrease in viscosity at the glass
transition temperature Tg, and the subsequent viscosity
increase driven by the crosslinking and network formation.
The macroscopic flow ceases at the gel point. With
further heating or time at the cure temperature, the
polymer continues to react and develop the fully cured
network. Dynamic mechanical analysis using oscillatory
parallel plate rheometry was used to measure the viscosity
during the non-isothermal curing of epoxy-based thermo-
setting polymers. Microdielectrometry performed
simultaneously with parallel-plate rheological methods
provided further insight into the physical changes that
occur during curing.

Speaker biographical background:

During his 18-year career in the electronics industry,
Dr. Gotro has studied structure-property-processing
relationships in thermosetting polymers. From 1982-1993,
he was with IBM in Endicott, NY, focusing on chemorheology
of thermosets during lamination. He also led development
of new materials for multilayer circuit board applications.
After IBM, he joined AlliedSignal Laminate Systems as
product development manager and oversaw development of
several new materials for electronic packaging applications.
In 1999, he became Director of Technology for the Advanced
Substrate Technologies & Interconnects Division of Honeywell
Electronic Materials in Costa Mesa, CA, where he led
development for a series of substrates for high-density
multilayer ball grid array flip chip packages. He has
published 58 technical papers, and is co-inventor on 10
patents with 7 pending. Dr. Gotro received a B.S. in
Mechanical Engineering from Marquette University and a
Ph.D. in Materials Science from Northwestern University.


PRACTICAL DETAILS for Jan. 23 meeting:

Cost: $30 regular
$15 for unemployed/retired/students
Free for just the talk at 8 PM
(but please let us know)

Social Hour: 6:00 PM
Dinner: 7:00 PM
Talk: 8:00 PM

Dinner Choices: Broiled Salmon, Chicken Marsala, or
Vegetarian Lasagna

Location: Michael's at Shoreline, Mountain View


- Make reservations by 5 PM Friday Jan. 19.

- Please provide contact information (email or phone),
name & affiliation, and your DINNER CHOICE.

- You should receive confirmation of your registration;
if not, please try again.

- Register through the web site (preferred),

or contact:
Len Radzilowski

- We must ask you to be liable for the cost of
your dinner if you register and do not attend;
cancellations may be made up to the registration


From 101 in Mountain View, take the Shoreline Boulevard
Exit, turning toward the bay. Drive past the Shoreline
Amphitheater and go straight ahead into Shoreline Park.
After a mile or so in to the park, a sign for Michael's
will direct you to turn left into the parking lot.
Address: 2960 N Shoreline Blvd.
Restaurant phone: 650-962-1014
(do not call restaurant for reservations)



Feb. Dinner Lecture:
Tuesday Feb. 27, Michael's at Shoreline.
Professor Joseph DeSimone,
Dept. of Chemistry, Univ. of North Carolina

"The CO2 Technology Platform: From the Manufacture
of Teflon to Dry Processes in Microelectronics
Fabrication and the Cleaning of Garments."

Abstract and registration details forthcoming.

Ed. Note: Prof. DeSimone is one of the leading
contributors in the field of polymer science &
technology in the CO2 environment. Come and hear
examples of the state of the art for this
technology from one of its inventors.

GGPF 2001 Spring Symposium:
"Thermal Analysis at the New Millennium"

Monday, March 19, 2001
Michael's at Shoreline, 8:30 - 6:00 PM

Keynote Speakers:
- Harvey Blair, Bell Laboratories/Lucent Technologies
"Solving Plastics Problems by Thermal Analysis"
- Bruno von Mele, Free University of Brussels
title t.b.a.

Other Speakers t.b.a.

Vendor Presentations & Display Tables:
- TA Instruments (Len Thomas)
- Perkin Elmer (Bill Sichina)
- Mettler-Toledo (Jon Foreman)
- Haake-Seiko/Cahn (tba)
- Thermometric (tba)

Full program and registration details to be
announced. For further information in the interim,
contact Bruce Prime at

This should be an exceptional event and the special
vendor format provides a unique opportunity
here in the Bay Area for all of you who cannot easily
attend NATAS or PittConn events on the East Coast.


Academic Events in the near Future:

The Fourth Flory Conference in Macromolecular &
Physical Chemistry
Stanford, Feb. 2-3, 2001

This annual event usually has an outstanding set
speakers, and this year's event is no different.
See the web page for a complete list of speakers.

Note that there is a $200 fee for registration before
Jan. 26, but $400 for registration after Jan. 26.

There is a format change this year, presenting a special
opportunity: external participants are also invited to
present a poster at the Friday afternoon session, along
with Stanford students and postdocs. All you have to
do is send a title and short abstract along with your

Register through the web page, or contact
Ms. Lindi Press
(650) 723-0153

Special Polymer Short Course
Stanford University, Feb. 4-6, 2001
"Polymer Science: Synthesis to Processing

Taught by Stanford Professors Curt Frank,
Gerry Fuller, and Bob Waymouth.

Note that short course attendees get half-price
registration to the Flory Conference immediately
preceding the short course.

More information is available on the web page, or
Julia Harms

Jan. 27- May 26: San Jose State University
MatE 234, Sat mornings 9:00 - noon
"Microelectronic Packaging Materials Science",
Prof. Guna Selvaduray

Course Description (abridged): To educate
packaging engineers on the importance of materials
science principles, and how these play a key role
in the design, manufacture, performance, and
quality assurance of microelectronic packages.
The classes of materials - polymers, ceramics,
and metals - and their structure-processing-
properties relationships and relevance in packaging
will be studied. ... phase diagrams, diffusion
and mass transfer, bonding and soldering, corrosion,
materials testing methods, materials characterization
techniques, and failure analysis techniques.
Fabrication methods such as modeling, stamping,
deburring... Students are encouraged to bring with
them topics of interest for class discussion and

Room: Engr 301, SJSU

Enrollment: May be taken through SJSU Open
University for approximately $500 plus textbook and
instructional materials. For early enrollment,
contact 408-924-2670. Enrollment during the first
class will also be facilitated.

For further information, contact Prof. Selvaduray

We are sorry but this event is not yet open for registration.

You will be able to register starting